october 2010 doc id 18144 rev 1 1/7 7 EMIF02-USB04F3 3-line ipad?, emi filter including esd protection features emi symmetrical (i/o) low-pass filter high efficiency in emi/esd protection lead-free package very thin package high reliability offered by monolithic integration high reduction of parasitic elements through integration and wafer level packaging complies with the following standards iec 61000-4-2 level 4 (on external pins b1 and c1): ? 15 kv (air discharge) ? 8 kv (contact discharge) iec 61000-4-2 level 1 (on internal pins): ? 2 kv (air discharge) ? 2 kv (contact discharge) applications where emi filtering in es d sensitive equipment is required: mobile phones and communication systems computers, printers and mcu boards description the EMIF02-USB04F3 chip is a highly integrated audio filter device designed to suppress emi/rfi noise in all systems subjected to electromagnetic interference. this filter includes esd protection circuitry, which prevents damage to the protected device when subjected to esd surges up to 15 kv. figure 1. pin configuration (bump side) figure 2. configuration tm : ipad is a trademark of stmicroelectronics. lead-free flip-chip package (9 bumps) 3 2 1 a b c 3 2 1 a b1 a1 r1 r2 r5 a2 c1 c3 a3 c = 20 pf max line b2 r4 r3 c2 b3 www.st.com
electrical characteristics EMIF02-USB04F3 2/7 doc id 18144 rev 1 1 electrical characteristics figure 3. electrical characteristics (definitions) table 1. absolute maximum ratings (t amb = 25 c) symbol parameter value unit v pp internal pins (a2, a3, b2, b3, c2, c3): esd discharge iec 61000-4-2, level 1, air discharge esd discharge iec 61000-4-2, level 1, contact discharge external pins (a1, b1, c1): esd discharge iec 61000-4-2, level 4, air discharge esd discharge iec 61000-4-2, level 4, contact discharge 2 2 15 8 kv p d line resistance power dissipation at 70 c 60 mw t op operating temperature range - 40 to + 85 c t stg storage temperature range - 55 to 150 c table 2. electrical characteristics (t amb = 25 c) symbol test conditions min. typ. max. unit v br i r = 1 ma 7 v i rm v rm = 3 v per line 100 na r 1, r 2 tolerance 5% 33 r 4, r 5 tolerance 20% 18.5 k r 3 1425 1490 1560 c line v line = 0 v, v osc = 30 mv, f = 1 mhz (measured under zero light conditions) 20 pf v br v rm i rm i r v i i rm i r v rm v br v br v rm i rm i r v i i rm i r i rm i r v rm v br symbol parameter v = breakdown voltage i = leakage current @ v br rm rm c = line capacitance = line r series resistance between input and output i/o
EMIF02-USB04F3 electrical characteristics doc id 18144 rev 1 3/7 figure 4. s21 (db) attenuation measurement on c3-c1 and a3-b1 figure 5. analog crosstalk measurements on c3 - a1 1.0m 3.0m 10.0m 30.0m 100.0m 300.0m 1.0g 3.0g d+ d - f = 335 mhz c - 60.00 - 50.00 - 40.00 - 30.00 - 20.00 - 10.00 0.00 db d+ -12.3 d - -12.0 -19.5 d+ -20.4 d- s21(db) f = 900 mhz s21(db) f = 1.8 ghz v= 0v bias f/hz 1.0m 3.0m 10.0m 30.0m 100.0m 300.0m 1.0g 3.0g d+/d - - 60.00 - 50.00 - 40.00 - 30.00 - 20.00 - 10.00 0.00 xtalk (db) xtalk (db) 300 khz < f < 3 ghz >-12 f/hz v= 0v bias figure 6. digital crosstalk measurement on c3-b1 in 50 environment figure 7. esd response to iec 61000-4-2 (+15 kv air discharge) on one input v (in) and on one output v (out) c2 c1 d-out d+in 1 v/div. 100 mv/div. 10 ns/div. 10 ns/div. input output c2 c3 20 v/div. 10 v/div. 100 ns/div 100 ns/div figure 8. esd response to iec 61000-4-2 (-15 kv air discharge) on one input v (in) and on one output v (out) figure 9. line capacitance versus applied voltage (typical values, line c1-b2) c2 c3 20 v/div. 10 v/div. 100 ns/div 100 ns/div input output 0 2 4 6 8 10 12 14 16 18 0123456 c (pf) v (v) r
ordering information scheme EMIF02-USB04F3 4/7 doc id 18144 rev 1 2 ordering information scheme figure 10. ordering information scheme emif yy - xxx zz fx emi filter number of lines information package x = resistance value (ohms) z = capacitance value / 10(pf) or 3 letters = application 2 digits = version f = flip chip x = 3: lead-free, pitch = 400 m
EMIF02-USB04F3 package information doc id 18144 rev 1 5/7 3 package information in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 11. package dimensions figure 14. flip chip tape and reel specification figure 12. footprint figure 13. marking 1.14 mm 30 m 1.14 mm 30 m 255 m 40 400 m 40 400 m 40 170 m 10 170 m 10 500 m 50 220 m recommended 220 m recommended 260 m maximum solder stencil opening: copper pad diameter: solder mask opening: 300 m minimum x y x w z w dot, st logo xx = marking yww = datecode (y = year ww = week) z = manufacturing location ecopak grade user direction of unreeling all dimensions in mm 4.0 0.1 2.0 0.05 8.0 0.3 1.75 0.1 3.5 - 0.1 ? 1.5 0.1 0.69 0.05 1.24 1.24 4.0 0.1 st st st xxz yww xxz yww xxz yww xxz yww xxz yww xxz yww st st st xxz yww xxz yww xxz yww xxz yww xxz yww xxz yww dot identifying pin a1 location
ordering information EMIF02-USB04F3 6/7 doc id 18144 rev 1 4 ordering information table 3. ordering information note: more information is availa ble in the application notes: an2348: ?stmicroelectronics 400 micro-metre flip chip: package description and recommendation for use? an1751: "emi filters: recommendations and measurements" 5 revision history table 4. document revision history order code marking package weight base qty delivery mode EMIF02-USB04F3 jm flip chip 1.4 mg 5000 tape and reel (7") date revision changes 21-oct-2010 1 first issue.
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